The DTC Cooling System includes FlexFusion™ cabinets and rack manifolds that work together to deliver uniform, leak-free liquid cooling directly to the chip. Key features include:

• Movable e-rails and split-hinged doors for simplified buildouts.
• Electrically bonded steel frames for structural integrity
• Quick-connect manifolds with automatic air exhaust valves for fast, error-free installation.
• Standard cabinet footprint—no rear extensions or retrofitting required.

This design enables data center operators to deploy high-density AI servers without compromising space, speed, or reliability.

 Part of a Complete Cooling Portfolio

The DTC Cooling System complements Panduit’s existing Rear Door Heat Exchanger (RDHx) offering, creating a comprehensive liquid cooling strategy for modern data centers. Together, these solutions support scalable infrastructure across AI, HPC, and edge computing environments.