Exhibitor Products

23 Feb 2026

Hitema Turbocor® Chiller — 1,500 kW Air-Cooled Oil-Free Platform for High-Density Data Centers

Hitema International Stand: D40
Hitema Turbocor® Chiller — 1,500 kW Air-Cooled Oil-Free Platform for High-Density Data Centers

The Hitema Turbocor® Chiller is a fully engineered-to-order, air-cooled system developed specifically for high-density, AI-driven and HPC data center applications. The unit is designed to operate within mission-critical environments where redundancy, part-load efficiency, and precise thermal stability are mandatory design parameters. With a nominal cooling capacity of 1,500 kW per unit, the platform supports modular plant configurations for multi-megawatt installations.

Mechanical and Thermodynamic Configuration

Parameter

Specification

Compressor Technology

Oil-free magnetic bearing centrifugal compressors (Turbocor®)

Refrigerant

R1234ze (GWP < 1)

Refrigerant Circuits

3 fully independent circuits — enhanced redundancy and serviceability

Evaporator

Flooded shell-and-tube design for optimised heat transfer coefficient and stable leaving water temperature

Condenser

Air-cooled fin-and-tube coils, low air-side pressure drop, EC fan integration for variable airflow control and enhanced seasonal efficiency

Operating Ambient Range

−30°C to +45°C

Hydraulic Configuration

Primary-only or primary-secondary chilled water systems

Control and Operational Logic

The platform delivers on-demand capacity modulation via oil-free variable-speed compressors, with precision control of leaving water temperature for liquid cooling and CRAH/CRAC integration. Part-load performance is optimised for data center dynamic load profiles. The system offers full integration capability with BMS and DCIM systems, and redundancy strategies aligned with N+1 and 2N plant architectures.

Design Focus for Data center Applications

  • High part-load efficiency — critical for real-world AI and HPC operating conditions
  • Reduced mechanical wear due to oil-free magnetic bearing architecture
  • Simplified maintenance cycles and extended service intervals
  • Full compatibility with liquid cooling infrastructures and CDU integration
  • Engineered footprint optimisation for rooftop and plant deck installations

This platform is specifically engineered for: AI clusters with variable load profiles, high-density rack deployments, direct-to-chip liquid cooling plants, and hyperscale and colocation facilities.

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