Cold plate cooling represents a key step in the transition from air cooling to liquid cooling for high-performance data centers. Conventional solutions, typically based on deionized water or water-glycol mixtures, present several operational challenges. These include the risk of leakage, which can result in severe hardware damage, and maintenance requirements such as frequent filter cleaning that contribute to increased downtime and cost.
This session examines how Perstorp’s Synplate™ DC dielectric fluids address these limitations in direct-to-chip cooling applications. Designed for high dielectric strength, Synplate™ DC mitigates leakage-related risks while improving system reliability. The fluids’ inherent lubricating properties reduce maintenance frequency and extend component life, supporting improved water usage effectiveness. Performance claims are supported by third-party validation, including testing with RISE in Sweden. Additionally, these PFAS-free fluids align with sustainability objectives for current and future deployments.
As data center cooling strategies continue to evolve, immersion cooling is gaining traction for its ability to handle even higher thermal loads and improve energy efficiency. Building on the same principles of reliability and sustainability, Perstorp’s Synmerse™ DC portfolio offers OEM-tested, OCP-compliant solutions for full immersion cooling, enabling a seamless transition for operators seeking next-generation thermal management.